Технически параметри и характеристики за производство на печатни платки


Технически параметри


Layers: 1-16
Copper thickness: 0.5-3 oz (17um-105um)
Products Type: HF (High-Frequency) & (Radio Frequency) board, Imedance controlled board, HDI board, BGA & Fine pitch board
solder mask: Nanya&Taiyo, LPI&Matt red, green, yellow, white, blue, black.
Base Material: FR4, HI-TG, Rogers, Taconic, Argon, Naclo, Isola and so on
Finished Surface: Conventional HASL, Lead-Free HASL, Flash Gold, ENIG (Immersion Gold), OSP(Entek), Immersion Tin, Immersion Silver, Hard Gold
Selective Surface Treatment: ENIG (Immersion Gold) + OSP, ENIG (Immersion Gold) + Gold Finger, Flash Gold Finger, Immersion Sliver + Gold Finger, Immersion Tin + Gold Finger

Технически характеристики


Minimum line width/gap: 4mil
Minimum Hole Size: 0.15mm (mechanical drill), 4mil (laser drill)
Minimum Annular Ring: 4mil
Max Copper Thickness: 3 oz
Max Production Size: 600mm*800mm
Board Thickness: D/S: 0.2-7.0mm, Multilayer: 0.40-7.0mm
Min Solder Mask Bridge: ≥0.08mm
Aspect Ratio: 15:1
Plugging Vias Capability: 0.2-0.8mm

Толеранси


Plated holes Tolerance: ±0.08mm (min±0.05)
Non-Plated Hole Tolerance: ±0.05mm (min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance: ±0.15mm (min±0.10mm)

Функционален тест


Insulating Resistance: 50ohms (normality)
Peel Off Strength: 1.4N/mm
Thermal Stress Test: 265℃, 20seconds
Solder Mask Hardness: 6H
E-test Voltage: 500V+15/-0V 30s
Warp and Twist: 0.7% (Semiconductor test board 0.3%)