| Layers: | 1-16 |
| Copper thickness: | 0.5-3 oz (17um-105um) |
| Products Type: | HF (High-Frequency) & (Radio Frequency) board, Imedance controlled board, HDI board, BGA & Fine pitch board |
| solder mask: | Nanya&Taiyo, LPI&Matt red, green, yellow, white, blue, black. |
| Base Material: | FR4, HI-TG, Rogers, Taconic, Argon, Naclo, Isola and so on |
| Finished Surface: | Conventional HASL, Lead-Free HASL, Flash Gold, ENIG (Immersion Gold), OSP(Entek), Immersion Tin, Immersion Silver, Hard Gold |
| Selective Surface Treatment: | ENIG (Immersion Gold) + OSP, ENIG (Immersion Gold) + Gold Finger, Flash Gold Finger, Immersion Sliver + Gold Finger, Immersion Tin + Gold Finger |
| Minimum line width/gap: | 4mil |
| Minimum Hole Size: | 0.15mm (mechanical drill), 4mil (laser drill) |
| Minimum Annular Ring: | 4mil |
| Max Copper Thickness: | 3 oz |
| Max Production Size: | 600mm*800mm |
| Board Thickness: | D/S: 0.2-7.0mm, Multilayer: 0.40-7.0mm |
| Min Solder Mask Bridge: | ≥0.08mm |
| Aspect Ratio: | 15:1 |
| Plugging Vias Capability: | 0.2-0.8mm |
| Plated holes Tolerance: | ±0.08mm (min±0.05) |
| Non-Plated Hole Tolerance: | ±0.05mm (min+0/-0.05mm or +0.05/-0mm) |
| Outline Tolerance: | ±0.15mm (min±0.10mm) |
| Insulating Resistance: | 50ohms (normality) |
| Peel Off Strength: | 1.4N/mm |
| Thermal Stress Test: | 265℃, 20seconds |
| Solder Mask Hardness: | 6H |
| E-test Voltage: | 500V+15/-0V 30s |
| Warp and Twist: | 0.7% (Semiconductor test board 0.3%) |